Micron CFO Clarifies: HBM4 Memory Has Entered Mass Production, Overall Progress Better Than Previously Expected

2026-02-23 19:34:33

Abstract generation in progress

Tech Home, February 12 — Micron Technology’s Chief Financial Officer Mark Murphy clarified at the Wolfe Research Automotive, Automotive Technology, and Semiconductors Conference held yesterday that the company’s HBM4 memory has entered mass production, with overall progress exceeding previous expectations.

Mark Murphy stated that Micron has begun shipping HBM4 memory to customers, and shipment volumes are expected to continue rising this quarter. The company’s HBM capacity is steadily increasing, and all HBM supplies for this calendar year have been sold out. The yield rates of HBM products, including HBM4, meet expectations. Micron’s HBM4 can achieve transmission speeds of 11Gbps, and the company is confident in its performance, quality, and reliability.

The CFO mentioned that market demand for memory semiconductors far exceeds the supply capacity of the entire industry, including Micron. For some key customers, Micron can only meet 50% to 66% of their demand. Micron expects memory supply to remain tight after 2026. Process upgrade capacity conversion is no longer sufficient to provide additional supply matching demand, and wafer fabrication plant construction takes even longer.

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