Gate News message, April 22 — SK Hynix announced plans to invest 19 trillion won (approximately $12.85 billion) in a new advanced packaging facility in South Korea, with construction set to begin this month to address rising demand for AI memory chips.
The plant, designated P&T7 and located in Cheongju next to the company’s M15X wafer production facility, will focus on high-bandwidth memory (HBM) packaging and testing. At approximately 231,400 square meters, it is expected to rank among the world’s largest HBM packaging sites. The co-location of wafer production and packaging aims to accelerate manufacturing efficiency. SK Hynix also announced it would spend 20 trillion won (approximately $13.6 billion) in 2025 on capacity expansion, including accelerating the opening of another memory chip plant in South Korea.
The investment is part of a three-part packaging strategy that includes existing operations in Icheon and a planned $4 billion advanced packaging and research hub in West Lafayette, Indiana. The company has also ordered chipmaking equipment worth 12 trillion won (approximately $7.97 billion) from ASML, the Dutch semiconductor equipment supplier.
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