Broadcom Launches Multi-Dimensional Stacked Chip Platform, Executives Claim to Sell 1 Million Units in the Next Two Years

A senior executive at American semiconductor company Broadcom stated that based on the latest stacked chip design technology, the company expects to sell at least 1 million chips by 2027.

Broadcom Vice President of Product Marketing Harish Bharadwaj told the media that the chips, with expected sales of 1 million units, are based on an independently developed technology: stacking two chips vertically to tightly connect different silicon wafers, significantly improving data transfer speeds between chips.

Earlier today, Broadcom announced that it has begun shipping the industry’s first 2-nanometer custom computing SoC based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform.

As a validated modular, multi-layer stacking chip platform, 3.5D XDSiP combines 2.5D technology with face-to-face (F2F) 3D-IC integration. Broadcom states that 3.5D XDSiP is the foundation for the next-generation XPU.

Bharadwaj said that this stacking architecture can help customers create more powerful, lower-power chips to meet the growing computational demands of AI software. “Almost all of our customers are now adopting this technology.”

It is understood that Broadcom spent about five years laying the groundwork and repeatedly testing various solutions before finally achieving commercialization. Engineers are currently developing more advanced designs, aiming for stacks of up to eight layers, with two chips per layer.

Broadcom typically does not design complete AI chips independently but collaborates with customers: Broadcom engineers convert early designs into manufacturable physical layouts, which are then produced by manufacturers like TSMC.

Companies can flexibly combine TSMC’s different process nodes with Broadcom’s stacking technology according to their needs, with two chips fused directly during manufacturing.

Currently, its first customer, Fujitsu, has begun producing engineering samples to test this design and plans to mass-produce this stacked chip later this year.

Fujitsu is using this new technology to develop a data center chip. The chip is manufactured by TSMC using the most advanced 2-nanometer process and is integrated with a 5-nanometer chip.

Broadcom also has multiple stacking designs in progress, with plans to launch two more related products in the second half of this year and to provide three more samples by 2027.

Benefiting from customized collaborations with companies like Google, Broadcom’s chip business has seen significant growth. The company expects its AI chip revenue to double year-over-year to $8.2 billion in the first quarter of this fiscal year.

(Source: Cailian Press)